Hot Combination Wafer Lapping Machine from Japan
Machine that combines hot processing and lapping to achieve dimensional tolerances on semiconductor wafers from boule slices. Falls under HTS 8455.21.00.00 for combination hot/cold rolling mills in wafer preparation.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Demonstrate combination hot/cold capability with temperature control specs
• Certify flatness achievement (<1μm) for wafer fab readiness
• Avoid Chapter 84 general lapping by proving semiconductor sequence fit