Hot or combination hot and cold
Metal-rolling mills and rolls therefor; parts thereof: > Other rolling mills: > Hot or combination hot and cold
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8455.21.00.00
Czochralski Crystal Puller for Silicon Wafers
A machine that uses the Czochralski method to grow monocrystalline silicon boules from molten silicon, from which semiconductor wafers are sliced. It falls under HTS 8455.21.00.00 as a hot rolling mill because the crystal growth process involves controlled heating and pulling, akin to hot processing of semiconductor materials into boule form prior to wafer fabrication.
Crystal Boule Grinder for Wafer Preparation
Precision grinder that shapes semiconductor crystal boules to exact diameters and flats indicating conductivity type before wafer slicing. Under HTS 8455.21.00.00 as hot rolling mill equipment since it processes hot-grown boules in the wafer manufacturing sequence.
Hot Combination Wafer Lapping Machine
Machine that combines hot processing and lapping to achieve dimensional tolerances on semiconductor wafers from boule slices. Falls under HTS 8455.21.00.00 for combination hot/cold rolling mills in wafer preparation.
Silicon Boule Hot Roller Straightener
Hot rolling mill that applies controlled heat and pressure to straighten crystal boules post-growth for uniform wafer slicing. Specifically under HTS 8455.21.00.00 for hot semiconductor material processing.
GaAs Wafer Surface Polisher Hot Stage
Polishing equipment with integrated hot stage for gallium arsenide wafers to achieve mirror finish before fabrication. HTS 8455.21.00.00 as hot combination equipment in semiconductor wafer prep category.
Float Zone Crystal Grower for Gallium Arsenide
Equipment employing the float zone method to produce high-purity monocrystalline gallium arsenide boules for semiconductor wafers. Classified under HTS 8455.21.00.00 as a hot rolling mill due to the hot zone melting and zone refinement process simulating hot rolling of semiconductor material into boule form.
Semiconductor Wafer Slicing Diamond Saw
High-precision diamond wire saw that slices ultra-thin wafers from monocrystalline semiconductor boules like silicon or GaAs. HTS 8455.21.00.00 covers this as wafer preparation equipment in hot rolling mills category for semiconductor processing workflow.