Hot Combination Wafer Lapping Machine from Germany
Machine that combines hot processing and lapping to achieve dimensional tolerances on semiconductor wafers from boule slices. Falls under HTS 8455.21.00.00 for combination hot/cold rolling mills in wafer preparation.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Demonstrate combination hot/cold capability with temperature control specs
• Certify flatness achievement (<1μm) for wafer fab readiness
• Avoid Chapter 84 general lapping by proving semiconductor sequence fit