GaAs Wafer Surface Polisher Hot Stage from Japan
Polishing equipment with integrated hot stage for gallium arsenide wafers to achieve mirror finish before fabrication. HTS 8455.21.00.00 as hot combination equipment in semiconductor wafer prep category.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Specify CMP slurry compatibility and hot stage temps (200-400°C)
• Provide surface roughness specs (Ra <1nm)
• Document as post-slicing prep, not final fab polishing