GaAs Wafer Surface Polisher Hot Stage from Japan
Polishing equipment with integrated hot stage for gallium arsenide wafers to achieve mirror finish before fabrication. HTS 8455.21.00.00 as hot combination equipment in semiconductor wafer prep category.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify CMP slurry compatibility and hot stage temps (200-400°C)
• Provide surface roughness specs (Ra <1nm)
• Document as post-slicing prep, not final fab polishing