Czochralski Crystal Puller for Silicon Wafers from Japan
A machine that uses the Czochralski method to grow monocrystalline silicon boules from molten silicon, from which semiconductor wafers are sliced. It falls under HTS 8455.21.00.00 as a hot rolling mill because the crystal growth process involves controlled heating and pulling, akin to hot processing of semiconductor materials into boule form prior to wafer fabrication.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Verify equipment qualifies under statistical notes for semiconductor wafer manufacturing to ensure correct classification
• Provide detailed technical specs and end-use certificates proving use in crystal growth for boule production
• Avoid misclassification as general machinery by documenting Czochralski method specifics