Crystal Boule Grinder for Wafer Preparation from Japan
Precision grinder that shapes semiconductor crystal boules to exact diameters and flats indicating conductivity type before wafer slicing. Under HTS 8455.21.00.00 as hot rolling mill equipment since it processes hot-grown boules in the wafer manufacturing sequence.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Submit engineering drawings showing flat-grinding for resistivity indication
• Classify with boule production line; separate from final wafer grinders
• Document tolerances (e.g
• ±0.1mm diameter) to prove semiconductor specificity