Crystal Boule Grinder for Wafer Preparation from China
Precision grinder that shapes semiconductor crystal boules to exact diameters and flats indicating conductivity type before wafer slicing. Under HTS 8455.21.00.00 as hot rolling mill equipment since it processes hot-grown boules in the wafer manufacturing sequence.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Submit engineering drawings showing flat-grinding for resistivity indication
• Classify with boule production line; separate from final wafer grinders
• Document tolerances (e.g
• ±0.1mm diameter) to prove semiconductor specificity