Crystal Boule Grinder for Wafer Preparation from Canada
Precision grinder that shapes semiconductor crystal boules to exact diameters and flats indicating conductivity type before wafer slicing. Under HTS 8455.21.00.00 as hot rolling mill equipment since it processes hot-grown boules in the wafer manufacturing sequence.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Submit engineering drawings showing flat-grinding for resistivity indication
• Classify with boule production line; separate from final wafer grinders
• Document tolerances (e.g
• ±0.1mm diameter) to prove semiconductor specificity