8454.90.00.60/Wafer Slicing Saw Blade Holder/Japan

Wafer Slicing Saw Blade Holder from Japan

Durable holder mechanism for diamond blades in wafer slicing saws that cut semiconductor boules into thin wafers. It is a part of casting machines under HTS 8454.90.00.60 for metallurgical semiconductor processing. Provides vibration-free slicing for flatness.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Include blade thickness tolerances and kerf specs in technical data sheets

• Demonstrate use in monocrystalline slicing to avoid tool reclassification