Other
Converters, ladles, ingot molds and casting machines, of a kind used in metallurgy or in metal foundries, and parts thereof: > Parts > Of casting machines: > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8454.90.00.60
Boule Lapping Machine Workhead
Workhead component for lapping machines that flatten semiconductor boules to precise tolerances before wafer slicing. Falls under HTS 8454.90.00.60 as parts of wafer preparation equipment in metallurgy. Achieves critical surface flatness.
Crystal Boule Casting Mold Frame
Structural frame for supporting ingot molds during semiconductor crystal growth in pullers and casters. Part of HTS 8454.90.00.60 as essential to metallurgical casting machines. Withstands thermal cycling.
Ingot Mold Temperature Control Sleeve
Insulating sleeve for ingot molds regulating crystallization temperature gradients in semiconductor casting. HTS 8454.90.00.60 part for precise metallurgical control. Made from advanced refractories.
Czochralski Crystal Puller Ingot Mold
This high-precision ingot mold is designed for use in Czochralski crystal pullers to produce monocrystalline silicon boules for semiconductor wafers. It falls under HTS 8454.90.00.60 as a part of casting machines used in metallurgy for growing pure semiconductor crystals. The mold ensures uniform heat distribution during the crystal growth process.
Float Zone Crystal Grower Crucible Assembly
A specialized crucible part for float zone crystal growers used to melt and purify semiconductor materials like silicon into monocrystalline form. Classified under HTS 8454.90.00.60 as a component of semiconductor casting machines in metallurgical processes. It maintains vacuum and high-temperature stability during zone refining.
Silicon Wafer Casting Ladle Nozzle
Precision-engineered nozzle for ladles in silicon casting machines used to pour molten semiconductor material into molds for ingot formation. It qualifies for HTS 8454.90.00.60 as a part of metallurgical casting machines for semiconductor production. The nozzle controls flow rate to minimize impurities.
Gallium Arsenide Ingot Mold Insert
Replaceable insert for ingot molds in casting machines processing gallium arsenide for compound semiconductor wafers. Falls under HTS 8454.90.00.60 as parts of specialized metallurgical casting equipment. Designed for compound semiconductor thermal profiles.
Semiconductor Crystal Grinder Coolant Nozzle
Nozzle assembly for directing coolant in crystal grinders that shape semiconductor boules to wafer specifications. Classified in HTS 8454.90.00.60 as a part of wafer preparation casting machines in metallurgy. Ensures precise diameter control during grinding.
Wafer Slicing Saw Blade Holder
Durable holder mechanism for diamond blades in wafer slicing saws that cut semiconductor boules into thin wafers. It is a part of casting machines under HTS 8454.90.00.60 for metallurgical semiconductor processing. Provides vibration-free slicing for flatness.
Semiconductor Wafer Polishing Platen
Rotating platen surface for polishers that prepare semiconductor wafers for fabrication by achieving mirror finish and flatness. Classified as a part of casting machines under HTS 8454.90.00.60 for metallurgical wafer prep. Uses specialized slurries.