Wafer Slicing Saw Blade Holder from Germany
Durable holder mechanism for diamond blades in wafer slicing saws that cut semiconductor boules into thin wafers. It is a part of casting machines under HTS 8454.90.00.60 for metallurgical semiconductor processing. Provides vibration-free slicing for flatness.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include blade thickness tolerances and kerf specs in technical data sheets
• Demonstrate use in monocrystalline slicing to avoid tool reclassification