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8454.90.00.60/Silicon Wafer Casting Ladle Nozzle/Japan

Silicon Wafer Casting Ladle Nozzle from Japan

Precision-engineered nozzle for ladles in silicon casting machines used to pour molten semiconductor material into molds for ingot formation. It qualifies for HTS 8454.90.00.60 as a part of metallurgical casting machines for semiconductor production. The nozzle controls flow rate to minimize impurities.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Document anti-corrosion coatings and orifice diameter specs for precise classification

• Pair with casting machine model numbers in invoices to demonstrate specificity

Silicon Wafer Casting Ladle Nozzle from Japan — Import Duty Rate | HTS 8454.90.00.60