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8454.90.00.60/Semiconductor Wafer Polishing Platen/Mexico

Semiconductor Wafer Polishing Platen from Mexico

Rotating platen surface for polishers that prepare semiconductor wafers for fabrication by achieving mirror finish and flatness. Classified as a part of casting machines under HTS 8454.90.00.60 for metallurgical wafer prep. Uses specialized slurries.

Duty Rate — Mexico → United States

10%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Specify platen material (e.g

• tin/lead alloy) and polish pad compatibility

• Provide evidence of use post-slicing in wafer flow

Semiconductor Wafer Polishing Platen from Mexico — Import Duty Rate | HTS 8454.90.00.60