Semiconductor Wafer Polishing Platen from Germany
Rotating platen surface for polishers that prepare semiconductor wafers for fabrication by achieving mirror finish and flatness. Classified as a part of casting machines under HTS 8454.90.00.60 for metallurgical wafer prep. Uses specialized slurries.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Specify platen material (e.g
• tin/lead alloy) and polish pad compatibility
• Provide evidence of use post-slicing in wafer flow