Semiconductor Wafer Polishing Platen from Germany
Rotating platen surface for polishers that prepare semiconductor wafers for fabrication by achieving mirror finish and flatness. Classified as a part of casting machines under HTS 8454.90.00.60 for metallurgical wafer prep. Uses specialized slurries.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify platen material (e.g
• tin/lead alloy) and polish pad compatibility
• Provide evidence of use post-slicing in wafer flow