Semiconductor Wafer Polishing Platen from Canada
Rotating platen surface for polishers that prepare semiconductor wafers for fabrication by achieving mirror finish and flatness. Classified as a part of casting machines under HTS 8454.90.00.60 for metallurgical wafer prep. Uses specialized slurries.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Specify platen material (e.g
• tin/lead alloy) and polish pad compatibility
• Provide evidence of use post-slicing in wafer flow