8454.90.00.60/Boule Lapping Machine Workhead/Mexico

Boule Lapping Machine Workhead from Mexico

Workhead component for lapping machines that flatten semiconductor boules to precise tolerances before wafer slicing. Falls under HTS 8454.90.00.60 as parts of wafer preparation equipment in metallurgy. Achieves critical surface flatness.

Duty Rate — Mexico → United States

10%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico

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Import Tips

• Document flatness specifications (e.g

• <1 micron) for classification support

• Include pressure and rotation control details

• Avoid generic 'lapping head' terms that trigger machine tool duties