Boule Lapping Machine Workhead from Germany
Workhead component for lapping machines that flatten semiconductor boules to precise tolerances before wafer slicing. Falls under HTS 8454.90.00.60 as parts of wafer preparation equipment in metallurgy. Achieves critical surface flatness.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document flatness specifications (e.g
• <1 micron) for classification support
• Include pressure and rotation control details
• Avoid generic 'lapping head' terms that trigger machine tool duties