8454.90.00.60/Boule Lapping Machine Workhead/China

Boule Lapping Machine Workhead from China

Workhead component for lapping machines that flatten semiconductor boules to precise tolerances before wafer slicing. Falls under HTS 8454.90.00.60 as parts of wafer preparation equipment in metallurgy. Achieves critical surface flatness.

Duty Rate — China → United States

37.5%

Rate breakdown

9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]

9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China

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Import Tips

• Document flatness specifications (e.g

• <1 micron) for classification support

• Include pressure and rotation control details

• Avoid generic 'lapping head' terms that trigger machine tool duties