Wafer Slicing Diamond Saw from Japan
High-precision saw using diamond blades to slice thin wafers from monocrystalline semiconductor boules produced by casting machines. Classified in HTS 8454.30.00 per statistical notes as wafer slicing saws in the metallurgical casting chain for semiconductor foundries.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide evidence of integration in boule-to-wafer casting workflow
• Certify diamond blade specs for semiconductor material slicing