Casting machines
Converters, ladles, ingot molds and casting machines, of a kind used in metallurgy or in metal foundries, and parts thereof: > Casting machines
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8454.30.00
Silicon Ingot Casting Furnace
Directional solidification furnace for casting polycrystalline silicon ingots used in solar and semiconductor applications, involving controlled cooling of molten silicon. It qualifies under HTS 8454.30.00 as a casting machine in metal foundries for metallurgical semiconductor processing.
Gallium Arsenide Boule Caster
Liquid Encapsulated Czochralski (LEC) casting machine for growing GaAs compound semiconductor boules used in optoelectronics. HTS 8454.30.00 covers such metallurgy casting machines for processing gallium arsenide per statistical notes.
Ingot Casting Ladle for Semiconductor Foundries
Specialized ladle for pouring molten silicon into casting molds in semiconductor metallurgy, with temperature control. Though borderline, included in HTS 8454.30.00 scope for foundry casting equipment.
Precision Wafer Polishing Caster Auxiliary
Polishing machine for final surface flatness on semiconductor wafers from casting process, critical for fab readiness. HTS 8454.30.00 per notes for wafer grinders, lappers, polishers in metallurgy.
Czochralski Crystal Puller
A casting machine used in semiconductor manufacturing to grow monocrystalline silicon boules via the Czochralski method by pulling a seed crystal from molten silicon. It falls under HTS 8454.30.00 as a specialized casting machine employed in metallurgy for producing high-purity ingots from which semiconductor wafers are sliced.
Float Zone Crystal Grower
Casting apparatus using the float zone method to produce extremely pure monocrystalline semiconductor boules without a crucible, ideal for high-resistivity silicon. Classified under HTS 8454.30.00 for its role as a metallurgy casting machine in semiconductor material production.
Crystal Boule Grinder
Precision grinding machine for shaping semiconductor crystal boules to exact diameters and flats indicating conductivity type, post-casting preparation. Under HTS 8454.30.00 as wafer preparation equipment integral to metallurgical casting processes in semiconductor foundries.
Wafer Slicing Diamond Saw
High-precision saw using diamond blades to slice thin wafers from monocrystalline semiconductor boules produced by casting machines. Classified in HTS 8454.30.00 per statistical notes as wafer slicing saws in the metallurgical casting chain for semiconductor foundries.
Semiconductor Wafer Lapping Machine
Lapping equipment to achieve flatness and dimensional tolerances on semiconductor wafers after slicing from cast boules. Falls under HTS 8454.30.00 as specified wafer preparation apparatus in metallurgy/semiconductor casting processes.
Continuous Casting Machine for Silicon
Machine for continuous casting of silicon into ribbon or sheet form for photovoltaic semiconductors, using metallurgy foundry techniques. Classified under HTS 8454.30.00 as a casting machine in metal foundries.