Other

Converters, ladles, ingot molds and casting machines, of a kind used in metallurgy or in metal foundries, and parts thereof: > Casting machines > Other

Duty Rate (from China)

35%
MFN Base RateFree

Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]

Total Effective Rate35%

Products classified under HTS 8454.30.00.90

Crystal Ingot Slicing Saw

Precision diamond wire saws slice monocrystalline boules into thin semiconductor wafers with minimal kerf loss. Included in HTS 8454.30.00.90 as wafer slicing equipment under statistical note (a)(ii)(B) for metallurgical casting processes.

Directional Solidification Furnace

Furnaces using Bridgman or heat exchanger methods for controlled semiconductor ingot solidification from melt. Classified under HTS 8454.30.00.90 as other metallurgical casting machines for crystal growth per statistical notes.

Boule Diameter Grinder

Automated grinders that shape crystal boules to precise wafer diameters with orientation flats for conductivity indication. HTS 8454.30.00.90 statistical note (a)(ii)(A) specifically covers crystal grinders as metallurgical casting equipment.

Crystal Boule Grinder

Crystal boule grinders precisely shape semiconductor crystal ingots to exact diameters and flats indicating conductivity type before wafer slicing. This machine is an 'other' casting machine part under HTS 8454.30.00.90 for metallurgical preparation of semiconductor materials.

Czochralski Crystal Puller

A Czochralski crystal puller is a specialized casting machine used in semiconductor manufacturing to grow monocrystalline silicon boules from molten material by slowly pulling a seed crystal. It falls under HTS 8454.30.00.90 as 'other' casting machines of a kind used in metallurgy for producing high-purity ingots essential for wafer production.

Float Zone Crystal Grower

Float zone crystal growers use a floating molten zone to purify and grow monocrystalline semiconductor ingots, particularly for high-resistivity silicon wafers. Classified under HTS 8454.30.00.90 as other casting machines in metallurgy for semiconductor boule production.

Semiconductor Ingot Casting Furnace

High-vacuum ingot casting furnaces melt and control crystallization of silicon or gallium arsenide for semiconductor boule formation in metallurgical processes. Falls under HTS 8454.30.00.90 as other casting machines specialized for semiconductor metallurgy.

Wafer Preparation Lapping Machine

Lapping machines for semiconductor wafers achieve ultra-flat surfaces by abrasive slurry processing after boule slicing, essential for fabrication readiness. Classified as other casting machines under HTS 8454.30.00.90 per statistical notes for wafer preparation in metallurgy.

Gallium Arsenide Boule Puller

Specialized pullers for growing GaAs compound semiconductor boules using liquid-encapsulated Czochralski methods in metallurgical casting setups. HTS 8454.30.00.90 covers this as other casting machines explicitly noted for gallium arsenide processing.

Silicon Wafer Polishing Machine

Chemical-mechanical polishing (CMP) machines flatten semiconductor wafers to atomic-level smoothness for device fabrication. HTS 8454.30.00.90 includes this as other wafer preparation equipment (statistical note a)(ii)(C) in metallurgy casting context.