Semiconductor Wafer Lapping Machine from Germany
Lapping equipment to achieve flatness and dimensional tolerances on semiconductor wafers after slicing from cast boules. Falls under HTS 8454.30.00 as specified wafer preparation apparatus in metallurgy/semiconductor casting processes.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Include process flow diagrams linking to upstream casting machines
• Ensure documentation highlights semiconductor-specific tolerances