Precision Wafer Polishing Caster Auxiliary from Japan
Polishing machine for final surface flatness on semiconductor wafers from casting process, critical for fab readiness. HTS 8454.30.00 per notes for wafer grinders, lappers, polishers in metallurgy.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Link to statistical note on polishers
• Flatness tolerance specs required