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Precision Wafer Polishing Caster Auxiliary from Japan

Polishing machine for final surface flatness on semiconductor wafers from casting process, critical for fab readiness. HTS 8454.30.00 per notes for wafer grinders, lappers, polishers in metallurgy.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

Import Tips

Link to statistical note on polishers

Flatness tolerance specs required

Precision Wafer Polishing Caster Auxiliary from Japan — Import Duty Rate | HTS 8454.30.00