Crystal Boule Grinder from Japan
Precision grinding machine for shaping semiconductor crystal boules to exact diameters and flats indicating conductivity type, post-casting preparation. Under HTS 8454.30.00 as wafer preparation equipment integral to metallurgical casting processes in semiconductor foundries.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Submit engineering drawings showing boule grinding for semiconductor specs
• Label as metallurgy casting auxiliary to align with chapter notes