Crystal Boule Grinder from Japan
Precision grinding machine for shaping semiconductor crystal boules to exact diameters and flats indicating conductivity type, post-casting preparation. Under HTS 8454.30.00 as wafer preparation equipment integral to metallurgical casting processes in semiconductor foundries.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Submit engineering drawings showing boule grinding for semiconductor specs
• Label as metallurgy casting auxiliary to align with chapter notes