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8454.30.00.90/Wafer Preparation Lapping Machine/Mexico

Wafer Preparation Lapping Machine from Mexico

Lapping machines for semiconductor wafers achieve ultra-flat surfaces by abrasive slurry processing after boule slicing, essential for fabrication readiness. Classified as other casting machines under HTS 8454.30.00.90 per statistical notes for wafer preparation in metallurgy.

Duty Rate — Mexico → United States

10%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Submit flatness tolerance data (<1 micron) proving semiconductor application

• Pair with boule sourcing docs for full wafer manufacturing chain evidence

Wafer Preparation Lapping Machine from Mexico — Import Duty Rate | HTS 8454.30.00.90