8454.30.00.90/Wafer Preparation Lapping Machine/Japan

Wafer Preparation Lapping Machine from Japan

Lapping machines for semiconductor wafers achieve ultra-flat surfaces by abrasive slurry processing after boule slicing, essential for fabrication readiness. Classified as other casting machines under HTS 8454.30.00.90 per statistical notes for wafer preparation in metallurgy.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Submit flatness tolerance data (<1 micron) proving semiconductor application

• Pair with boule sourcing docs for full wafer manufacturing chain evidence