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8454.30.00.90/Wafer Preparation Lapping Machine/Germany

Wafer Preparation Lapping Machine from Germany

Lapping machines for semiconductor wafers achieve ultra-flat surfaces by abrasive slurry processing after boule slicing, essential for fabrication readiness. Classified as other casting machines under HTS 8454.30.00.90 per statistical notes for wafer preparation in metallurgy.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
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Import Tips

• Submit flatness tolerance data (<1 micron) proving semiconductor application

• Pair with boule sourcing docs for full wafer manufacturing chain evidence

Wafer Preparation Lapping Machine from Germany — Import Duty Rate | HTS 8454.30.00.90