8454.30.00.90/Silicon Wafer Polishing Machine/Japan

Silicon Wafer Polishing Machine from Japan

Chemical-mechanical polishing (CMP) machines flatten semiconductor wafers to atomic-level smoothness for device fabrication. HTS 8454.30.00.90 includes this as other wafer preparation equipment (statistical note a)(ii)(C) in metallurgy casting context.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter

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Import Tips

• Demonstrate surface roughness specs (Ångstroms) for proper classification

• Slurry handling systems need chemical import coordination