Silicon Wafer Polishing Machine from Germany
Chemical-mechanical polishing (CMP) machines flatten semiconductor wafers to atomic-level smoothness for device fabrication. HTS 8454.30.00.90 includes this as other wafer preparation equipment (statistical note a)(ii)(C) in metallurgy casting context.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Demonstrate surface roughness specs (Ångstroms) for proper classification
• Slurry handling systems need chemical import coordination