Silicon Wafer Polishing Machine from Germany
Chemical-mechanical polishing (CMP) machines flatten semiconductor wafers to atomic-level smoothness for device fabrication. HTS 8454.30.00.90 includes this as other wafer preparation equipment (statistical note a)(ii)(C) in metallurgy casting context.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Demonstrate surface roughness specs (Ångstroms) for proper classification
• Slurry handling systems need chemical import coordination