Silicon Wafer Polishing Machine from Canada
Chemical-mechanical polishing (CMP) machines flatten semiconductor wafers to atomic-level smoothness for device fabrication. HTS 8454.30.00.90 includes this as other wafer preparation equipment (statistical note a)(ii)(C) in metallurgy casting context.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Demonstrate surface roughness specs (Ångstroms) for proper classification
• Slurry handling systems need chemical import coordination