Crystal Ingot Slicing Saw from Japan
Precision diamond wire saws slice monocrystalline boules into thin semiconductor wafers with minimal kerf loss. Included in HTS 8454.30.00.90 as wafer slicing equipment under statistical note (a)(ii)(B) for metallurgical casting processes.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Specify wire diameter and kerf specs for semiconductor wafer classification
• Coolant system docs prevent reclass as general saw (8461)
• Watch for blade classification split; declare as integral machine component