Crystal Ingot Slicing Saw from Japan
Precision diamond wire saws slice monocrystalline boules into thin semiconductor wafers with minimal kerf loss. Included in HTS 8454.30.00.90 as wafer slicing equipment under statistical note (a)(ii)(B) for metallurgical casting processes.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify wire diameter and kerf specs for semiconductor wafer classification
• Coolant system docs prevent reclass as general saw (8461)
• Watch for blade classification split; declare as integral machine component