Crystal Ingot Slicing Saw from Germany
Precision diamond wire saws slice monocrystalline boules into thin semiconductor wafers with minimal kerf loss. Included in HTS 8454.30.00.90 as wafer slicing equipment under statistical note (a)(ii)(B) for metallurgical casting processes.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Specify wire diameter and kerf specs for semiconductor wafer classification
• Coolant system docs prevent reclass as general saw (8461)
• Watch for blade classification split; declare as integral machine component