Crystal Ingot Slicing Saw from China
Precision diamond wire saws slice monocrystalline boules into thin semiconductor wafers with minimal kerf loss. Included in HTS 8454.30.00.90 as wafer slicing equipment under statistical note (a)(ii)(B) for metallurgical casting processes.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Specify wire diameter and kerf specs for semiconductor wafer classification
• Coolant system docs prevent reclass as general saw (8461)
• Watch for blade classification split; declare as integral machine component