Crystal Boule Grinder from Japan
Crystal boule grinders precisely shape semiconductor crystal ingots to exact diameters and flats indicating conductivity type before wafer slicing. This machine is an 'other' casting machine part under HTS 8454.30.00.90 for metallurgical preparation of semiconductor materials.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide statistical note evidence linking to wafer manufacturing equipment
• Label precisely for boule diameter tolerances to prove semiconductor specificity