Wafer Slicing Diamond Saw Blade from Germany
High-precision diamond saw blade part for wafer slicing saws that cut monocrystalline semiconductor boules into thin wafers, per statistical notes under wafer preparation equipment. Falls under HTS 8451.90.90 as replaceable parts of specialized cleaning/processing machinery for semiconductor 'fabrics' (wafers). Ensures damage-free slicing for subsequent fabrication processes.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include blade specifications showing diamond grit size and semiconductor compatibility in entry documentation
• Pair with machine import records to prove integral part status under 'parts thereof' provision