Wafer Slicing Diamond Saw Blade from China
High-precision diamond saw blade part for wafer slicing saws that cut monocrystalline semiconductor boules into thin wafers, per statistical notes under wafer preparation equipment. Falls under HTS 8451.90.90 as replaceable parts of specialized cleaning/processing machinery for semiconductor 'fabrics' (wafers). Ensures damage-free slicing for subsequent fabrication processes.
Duty Rate — China → United States
41%
Rate breakdown
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Include blade specifications showing diamond grit size and semiconductor compatibility in entry documentation
• Pair with machine import records to prove integral part status under 'parts thereof' provision