</>Build with Tariff Intelligence|Programmatic access to tariff calculations and HS code classification.Explore Developer Resources →
8451.90.90/Wafer Carrier Plate for Lapping/Mexico

Wafer Carrier Plate for Lapping from Mexico

Precision-machined carrier plate holding multiple semiconductor wafers during simultaneous double-sided lapping operations. HTS 8451.90.90 part of lapping/grinding equipment per statistical notes. Maintains wafer spacing and planarity during material removal.

Duty Rate — Mexico → United States

13.5%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Calculate with your customs valueVerify classification with AI

Import Tips

• Specify carrier material (stainless, resin), slot configuration, and wafer capacity

• Document thickness uniformity specs across carrier plate