8451.90.90/Wafer Carrier Plate for Lapping/Mexico

Wafer Carrier Plate for Lapping from Mexico

Precision-machined carrier plate holding multiple semiconductor wafers during simultaneous double-sided lapping operations. HTS 8451.90.90 part of lapping/grinding equipment per statistical notes. Maintains wafer spacing and planarity during material removal.

Duty Rate — Mexico → United States

13.5%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Specify carrier material (stainless, resin), slot configuration, and wafer capacity

• Document thickness uniformity specs across carrier plate

Wafer Carrier Plate for Lapping from Mexico — Import Duty Rate | HTS 8451.90.90