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8451.90.90/Wafer Carrier Plate for Lapping/Japan

Wafer Carrier Plate for Lapping from Japan

Precision-machined carrier plate holding multiple semiconductor wafers during simultaneous double-sided lapping operations. HTS 8451.90.90 part of lapping/grinding equipment per statistical notes. Maintains wafer spacing and planarity during material removal.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Specify carrier material (stainless, resin), slot configuration, and wafer capacity

• Document thickness uniformity specs across carrier plate