Wafer Carrier Plate for Lapping from Germany
Precision-machined carrier plate holding multiple semiconductor wafers during simultaneous double-sided lapping operations. HTS 8451.90.90 part of lapping/grinding equipment per statistical notes. Maintains wafer spacing and planarity during material removal.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify carrier material (stainless, resin), slot configuration, and wafer capacity
• Document thickness uniformity specs across carrier plate