</>Build with Tariff Intelligence|Programmatic access to tariff calculations and HS code classification.Explore Developer Resources →
8451.90.90/Wafer Carrier Plate for Lapping/Germany

Wafer Carrier Plate for Lapping from Germany

Precision-machined carrier plate holding multiple semiconductor wafers during simultaneous double-sided lapping operations. HTS 8451.90.90 part of lapping/grinding equipment per statistical notes. Maintains wafer spacing and planarity during material removal.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Calculate with your customs valueVerify classification with AI

Import Tips

• Specify carrier material (stainless, resin), slot configuration, and wafer capacity

• Document thickness uniformity specs across carrier plate

Wafer Carrier Plate for Lapping from Germany — Import Duty Rate | HTS 8451.90.90