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8451.90.90/Wafer Carrier Plate for Lapping/Canada

Wafer Carrier Plate for Lapping from Canada

Precision-machined carrier plate holding multiple semiconductor wafers during simultaneous double-sided lapping operations. HTS 8451.90.90 part of lapping/grinding equipment per statistical notes. Maintains wafer spacing and planarity during material removal.

Duty Rate — Canada → United States

13.5%

Rate breakdown

9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
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Import Tips

• Specify carrier material (stainless, resin), slot configuration, and wafer capacity

• Document thickness uniformity specs across carrier plate