Wafer Backside Grinder Diamond Wheel from Mexico
Specialized diamond grinding wheel for thinning semiconductor wafer backside from 775μm to 50-100μm for advanced packaging applications. Part of wafer grinder equipment under HTS 8451.90.90 statistical provisions. Maintains total thickness variation (TTV) <1μm across wafer.
Duty Rate — Mexico → United States
13.5%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify TTV specs and wafer thinning process parameters in technical data sheets
• Include stage-wise grinding profiles (coarse/medium/fine) documentation