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8451.90.90/Wafer Backside Grinder Diamond Wheel/Japan

Wafer Backside Grinder Diamond Wheel from Japan

Specialized diamond grinding wheel for thinning semiconductor wafer backside from 775μm to 50-100μm for advanced packaging applications. Part of wafer grinder equipment under HTS 8451.90.90 statistical provisions. Maintains total thickness variation (TTV) <1μm across wafer.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Specify TTV specs and wafer thinning process parameters in technical data sheets

• Include stage-wise grinding profiles (coarse/medium/fine) documentation