Wafer Backside Grinder Diamond Wheel from Germany
Specialized diamond grinding wheel for thinning semiconductor wafer backside from 775μm to 50-100μm for advanced packaging applications. Part of wafer grinder equipment under HTS 8451.90.90 statistical provisions. Maintains total thickness variation (TTV) <1μm across wafer.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Specify TTV specs and wafer thinning process parameters in technical data sheets
• Include stage-wise grinding profiles (coarse/medium/fine) documentation