Wafer Backside Grinder Diamond Wheel from China
Specialized diamond grinding wheel for thinning semiconductor wafer backside from 775μm to 50-100μm for advanced packaging applications. Part of wafer grinder equipment under HTS 8451.90.90 statistical provisions. Maintains total thickness variation (TTV) <1μm across wafer.
Duty Rate — China → United States
41%
Rate breakdown
9903.05.3112.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of China, as provided for in U.S. note 52 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Import Tips
• Specify TTV specs and wafer thinning process parameters in technical data sheets
• Include stage-wise grinding profiles (coarse/medium/fine) documentation