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8451.90.90/Wafer Backside Grinder Diamond Wheel/Canada

Wafer Backside Grinder Diamond Wheel from Canada

Specialized diamond grinding wheel for thinning semiconductor wafer backside from 775μm to 50-100μm for advanced packaging applications. Part of wafer grinder equipment under HTS 8451.90.90 statistical provisions. Maintains total thickness variation (TTV) <1μm across wafer.

Duty Rate — Canada → United States

13.5%

Rate breakdown

9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
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Import Tips

• Specify TTV specs and wafer thinning process parameters in technical data sheets

• Include stage-wise grinding profiles (coarse/medium/fine) documentation