8451.90.90/Wafer Backside Grinder Diamond Wheel/Canada

Wafer Backside Grinder Diamond Wheel from Canada

Specialized diamond grinding wheel for thinning semiconductor wafer backside from 775μm to 50-100μm for advanced packaging applications. Part of wafer grinder equipment under HTS 8451.90.90 statistical provisions. Maintains total thickness variation (TTV) <1μm across wafer.

Duty Rate — Canada → United States

13.5%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Calculate with your customs valueVerify classification with AI

Import Tips

• Specify TTV specs and wafer thinning process parameters in technical data sheets

• Include stage-wise grinding profiles (coarse/medium/fine) documentation

Wafer Backside Grinder Diamond Wheel from Canada — Import Duty Rate | HTS 8451.90.90