8451.90.90/Silicon Wafer Cleaning Brush Roller/Japan

Silicon Wafer Cleaning Brush Roller from Japan

PVA sponge brush roller part for post-grinding chemical cleaning stations removing slurry residue from semiconductor wafer surfaces. HTS 8451.90.90 as washing/cleaning machinery parts for wafer preparation. Critical for particle-free surfaces before lithography.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Document brush porosity (50-70 PPI), compression, and chemical resistance specs

• Specify megasonic or brush box compatibility for cleaning station integration