Semiconductor Wafer Lapping Plate from China
Cast iron or ceramic lapping plate used in wafer grinders/lappers to achieve precise flatness and dimensional tolerances on semiconductor wafers before fabrication. Covered under HTS 8451.90.90 as parts of wafer preparation equipment analogous to textile finishing machinery. Critical for surface preparation in crystal growers/puller production lines.
Duty Rate — China → United States
41%
Rate breakdown
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Certify plate material and flatness specs match statistical note requirements for semiconductor wafer processing
• Avoid bulk classification by providing machine model compatibility evidence