Gallium Arsenide Wafer Polisher Platen from China
Ceramic platen for chemical polishing compound III-V wafers like GaAs requiring special surface chemistry. Part of wafer polishing equipment HTS 8451.90.90 statistical notes. Achieves sub-nanometer surface roughness for optoelectronic applications.
Duty Rate — China → United States
41%
Rate breakdown
9903.05.3112.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of China, as provided for in U.S. note 52 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Import Tips
• Specify GaAs etch rate compatibility and platen material (alumina, tin oxide)
• Include surface roughness specs (Ra <0.5nm) proving polishing function