Double-Sided Wafer Lapper Ring from Japan
Conditioning ring for double-sided lapping machines processing semiconductor wafers simultaneously on both surfaces for ultimate flatness. HTS 8451.90.90 as lapping equipment parts per statistical notes. Distributes slurry evenly across multiple wafers in carrier plates.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide ring material (resin, stainless) and slurry flow groove specifications
• Document conditioning frequency and lapper plate diameter compatibility