8451.90.90/Double-Sided Wafer Lapper Ring/Japan

Double-Sided Wafer Lapper Ring from Japan

Conditioning ring for double-sided lapping machines processing semiconductor wafers simultaneously on both surfaces for ultimate flatness. HTS 8451.90.90 as lapping equipment parts per statistical notes. Distributes slurry evenly across multiple wafers in carrier plates.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Provide ring material (resin, stainless) and slurry flow groove specifications

• Document conditioning frequency and lapper plate diameter compatibility