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8451.90.90/Double-Sided Wafer Lapper Ring/Germany

Double-Sided Wafer Lapper Ring from Germany

Conditioning ring for double-sided lapping machines processing semiconductor wafers simultaneously on both surfaces for ultimate flatness. HTS 8451.90.90 as lapping equipment parts per statistical notes. Distributes slurry evenly across multiple wafers in carrier plates.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
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Import Tips

• Provide ring material (resin, stainless) and slurry flow groove specifications

• Document conditioning frequency and lapper plate diameter compatibility